Packaging and Test
Focusing on the Internet of Things, communications and artificial intelligence, Dinghe Innovation carries out advanced electronic packaging and testing relying on the Guangxi Key Laboratory for Advanced Packaging and System Integration of Semiconductor Chips. The team boasts capabilities in multi-physics collaborative design covering mechanics, thermology, electricity, optics and other disciplines. It can coordinate the coupling relationships among various physical effects from a systematic perspective and conduct high-precision, multi-scale modeling and simulation analysis, supporting full-chain research ranging from material and device levels to the system level.
Backed by solid theoretical foundations and abundant engineering experience, the company has delivered systematic technical support to leading industrial enterprises including Huawei, Zhenhua Guangfeng, Biwin Storage and Colorlight. Such services consist of optimization of critical process parameters, diagnosis and resolution of complex technical issues, R&D and design of new products, as well as customized technical training. These services have comprehensively boosted clients’ overall competitiveness in product performance, reliability and mass production efficiency.
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Chip Packaging & Testing Process Flow
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Scientific Research Cases
Team Business Cases
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